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EMC Symmetrix Solutions Design Exam for Technology Architects Sample Questions:

1. In Enginuity 5671 and earlier, how does SDRF/S behave when multiple writes to a device are received?

A) Third write waits while second write is acknowledged.
B) 4 Concurrent writes are supported on a single device.
C) 8 Concurrent writes are supported on a single device.
D) Second write waits while first write is acknowledged.

2. What is best practice for binding thin devices in a FAST VP environment?

A) Bind all devices to a pool within the highest tier available.
B) Bind thin devices only to pools that show sufficient Pool Reserved Capacity.
C) Bind all devices to a thin pool within the second highest tier.
D) Bind all devices to a thin pool within the lowest tier available.

3. What is the impact on response time when multiple concurrent writes to an RDF device arrive from different FA ports on a Symmetrix VMAX?

A) Concurrent SRDF/S writes will not help to improve response time.
B) Writes can run in parallel and response time is slightly improved.
C) Writes need to be finished before new writes arrive and negatively impacts response time.
D) Response time is mostly determined by the application write behavior.

4. A customer has requested multiple design solutions for their new FAST-enabled Symmetrix VMAX storage. You have the performance files and symapi_db.bin files for the three source DMX arrays.
Which type of analysis should be created with Tier Advisor to respond to the customer's request?

A) Peak period I/O
B) Tiered and non-tiered
C) Wide period I/O
D) "What-if" cost-benefit

5. Which workload is an ideal candidate for FAST VP?

A) Uniform
B) Skewed
C) Concurrent
D) Static

Solutions: